Effect of Ti additions on the electrical resistivity of copper

被引:96
|
作者
Nagarjuna, S
Balasubramanian, K
Sarma, DS
机构
[1] NONFERROUS MAT TECHNOL DEV CTR,HYDERABAD 500058,ANDHRA PRADESH,INDIA
[2] BANARAS HINDU UNIV,DEPT MET ENGN,VARANASI 221005,UTTAR PRADESH,INDIA
关键词
copper-titanium alloys; electrical resistivity; transmission electron microscopy;
D O I
10.1016/S0921-5093(96)10578-5
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Electrical resistivity of Cu-Ti alloys containing 1.5, 2.7, 4.5 and 5.4 wt.% Ti, has been determined from the resistance values measured using Kelvins Bridge apparatus at room temperature. The resistivity in solution-treated alloys increases with Ti content linearly up to about 4.0 wt.% Ti, beyond which it decreases with further additions of Ti. However. in peak-aged condition, the resistivity continues to increase linearly up to 5.4 wt.% Ti without showing any decrease. Nordheim's rule of resistivity is followed up to approximately 4.0 wt.% Ti in the solution-treated alloys. Further. Nordheim's rule modified with the incorporation of the law of mixtures for two-phase systems (p(t) = p(m)v(fm) + p(p)v(fp)) is obeyed right up to 5.4 wt.% Ti in the peak-aged alloys. The difference in behaviour is attributed to the fine scale precipitation formed during quenching in solution-treated Cu-4.5Ti and Cu-5.4Ti alloys, as revealed by transmission electron microscopy (TEM). The contribution to the total resistivity by beta-Cu4Ti precipitate and prior cold deformation is considerable in deformed and peak-aged Cu-Ti alloys. (C) 1997 Elsevier Science S.A.
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页码:118 / 124
页数:7
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