Surface tension and density of binary lead and lead-free Sn-based solders

被引：31

作者：

Kaban, I ^{[1
]}

Mhiaoui, S

Hoyer, W

Gasser, JG

机构：

[1] Chemnitz Univ Technol, Inst Phys, D-09107 Chemnitz, Germany

[2] Univ Metz, Lab Phys Milieux Denses, F-57078 Metz 3, France

来源：

JOURNAL OF PHYSICS-CONDENSED MATTER | 2005年 / 17卷 / 50期

关键词：

D O I：

10.1088/0953-8984/17/50/007

中图分类号：

O469 [凝聚态物理学];

学科分类号：

070205 ;

摘要：

The surface tension and density of the liquid Sn60Pb40, Sn90Pb10, Sn96.5Ag3.5 and Sn97Cu3 solder alloys (wt%) have been determined experimentally over a wide temperature interval. It is established that the surface tension of liquid Sn90Pb10 is about 7% higher than that of a traditional Sn60Pb40 solder and that the surface tension of Sn96.5Ag3.5 and Sn97Cu3 alloys is about 12% higher than that of Sn60Pb40. The analytical expressions for the temperature dependences of the surface tension and density are given.

引用

页码：7867 / 7873

页数：7

共 11 条

[1]

Bulwith R., 2002, Global SMT & Packaging, V2, P16

[2]

CAROLL MA, 1987, MAT SCI TECHNOL, V3, P1040

[3]

de Gennes P.-G., 2002, GOUTTES BULLES PERLE

[4] Density and surface tension of the Pb-Sn liquid alloys [J].

Gasior, W ;

Moser, Z ;

Pstrus, J .

JOURNAL OF PHASE EQUILIBRIA, 2001, 22 (01) :20-25

[5]

GREINER W, 1984, THEORETISCHE PHYSIK

[6] THE SURFACE TENSION OF BINARY LIQUID MIXTURES - LEAD + TIN AND LEAD + INDIUM ALLOYS [J].

HOAR, TP ;

MELFORD, DA .

TRANSACTIONS OF THE FARADAY SOCIETY, 1957, 53 (03) :315-326

[7]

KABAN I, 2004, 12 INT C LIQ AM MET

[8]

Merkwitz M, 1998, Z METALLKD, V89, P247

[9]

Merkwitz M, 1997, THESIS TU CHEMNITZ

[10] Surface tension of liquid Ag-Sn alloys: Experiment versus modeling [J].

Moser, Z ;

Gasior, W ;

Pstrus, J .

JOURNAL OF PHASE EQUILIBRIA, 2001, 22 (03) :254-258

← 1 2 →