Transient liquid phase Ag-based solder technology for high-temperature packaging applications

被引：64

作者：

Sharif, Ahmed ^{[1
]}

Gan, Chee Lip ^{[2
]}

Chen, Zhong ^{[2
]}

机构：

[1] Bangladesh Univ Engn & Technol, Dept Mat & Met Engn, Dhaka 1000, Bangladesh

[2] Nanyang Technol Univ, Sch Mat Sci & Engn, Singapore 639798, Singapore

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2014年 / 587卷

关键词：

Harsh environment; Microelectronics packaging; Transient-liquid-phase; High-temperature reliability; Intermetallic compounds; MECHANICAL-PROPERTIES; DIE ATTACH; JOINTS; CREEP; PASTE; ZN;

D O I：

10.1016/j.jallcom.2013.10.204

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

A lead-free Ag-based soldering technique through transient-liquid-phase (TLP) bonding is proposed in this study for high-temperature microelectronic packaging applications. The solder paste, which contained Ag and Sn powders with a no-clean flux, was used to join Cu substrates. The setup was bonded at 250 degrees C for 10 minutes. The study focuses on mechanical and microstructural characterizations of the joints. The shear strength measured at 250 degrees C shows good high temperature performance of the joint. The effects of Ag and Sn contents on mechanical, electrical and thermal properties of sintered bulk Ag-Sn samples were also investigated independently. The results demonstrate that the Ag-Sn TLP bonding is an effective interconnection method for harsh environment electronic packaging. (C) 2013 Elsevier B.V. All rights reserved.

引用

页码：365 / 368

页数：4

共 19 条

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