Processing and interfacial bonding strength of 2014 Al matrix composites reinforced with oxidized SiC particles

被引：34
|
作者：
Kim, YM [1 ]
Lee, JC
机构：
[1] Chonnam Natl Univ, Dept Mat Sci & Engn, Kwangju 500757, South Korea
[2] Korea Univ, Dept Mat Sci & Engn, Seoul 136701, South Korea
来源：
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2006年 / 420卷 / 1-2期
基金：
欧洲研究理事会;
关键词：
metal matrix composite; interfacial bonding; interfacial reactions; hot pressing;
D O I：
10.1016/j.msea.2005.12.032
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The SiC powder with a SiO2 protective layer is used as the reinforcements for 2014 Al/SiCp composites to suppress the reaction between the Al matrix and the SiC particle. 2014 Al/SiCp composites were fabricated by vacuum hot pressing (VHP) and subsequent extrusion using 2014 Al powders and the SiC particles covered with a SiO2 layer. The inter-facial product was found to be Mg spinel (MgAl2O4) formed mainly by the chemical reactions of the SiO2 layer covered on SiC particles with the Mg, Al in the 2014 Al alloy matrix. Also the interfacial bonding strength of the composites was investigated using push-out tests of SiC rods with the SiO2 oxidation layer, which were processed within 2014 Al alloy. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码：8 / 12
页数：5
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