Ultrasound Multipath Signature Of Material Flaw Depth With Single mono/bi-static measurement

被引：0

作者：

Shen Xizhong ^{[1
]}

Yuan Kui ^{[1
]}

机构：

[1] Shanghai Inst Technol, Elect Informat Grp, Sch Elect & Elect Engn, Shanghai, Peoples R China

来源：

AUTOMATION EQUIPMENT AND SYSTEMS, PTS 1-4 | 2012年 / 468-471卷

关键词：

ultrasound; signal model; flaw; multipath; signature;

D O I：

10.4028/www.scientific.net/AMR.468-471.1199

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Ultrasonic signature of flaw is studied in the multipath scene, and a method is developed to localize the flaw by only single mono/bi-static measurement. A signal model based on the concept of multipath is built to construct flaw position, of which multipath scenarios are reviewed for signature of flaw depth. Multipath scenarios may be identified by direct path, which is relatively easy to be detected. Algebraic solution is proposed to solve the multipath equations to obtain the position of the flaw depth. Experiments show that the solution of the flaw depth is valid.

引用

页码：1199 / 1202

页数：4