Nano self-assembly for MEMS and microelectronics applications (Invited paper)

被引：1

作者：

Cui, TH ^{[1
]}

Lvov, Y

机构：

[1] Univ Minnesota, Mech Engn & Nanfabricat Ctr, 111 Church St SE, Minneapolis, MN 55455 USA

[2] Louisiana Tech Univ, Inst Micromfg, Ruston, LA 71272 USA

来源：

ICO20: MEM, MOEMS, AND NEMS | 2006年 / 6032卷

关键词：

nano self-asseiubly; MEMS; microelectronics;

D O I：

10.1117/12.667845

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents the combination of "bottom-up" layer-by-layer (LbL) nano self-assembly and "top-down" micromanufacturing techniques for MEMS and microelectronics applications. Two approaches. modified lift-off and metal mask, were utilized to pattern nano-assembled thin films effectively. With nano self-assembly and surface micromachining.. highly flexible nanoparticle-based magnetic cantilever platform for micro sensing and actuation was self-assembled. Self-assembled magnetic thin films on polymeric tunneling sensors were functional as a polymer actuators for the actuation of highly sensitive sensors. For microelectronics devices. self-assembled silica nanoparticle thin film acted as the dielectric layer for field-effect transistors. Nanoparticle- and polymer-based field-effect transistors with embedded nano self-assembled films as dielectric and active layers were fabricated and characterized successfully as well.

引用

页数：7

共 15 条

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