Thermal conductivity of W-Cu composites at various temperatures

被引:139
|
作者
Kim, YD [1 ]
Oh, NL
Oh, ST
Moon, IH
机构
[1] Hanyang Univ, Div Engn & Mat Sci, Seoul 133791, South Korea
[2] Hanyang Univ, Dept Met & Mat Sci, Ansan 425791, South Korea
基金
新加坡国家研究基金会;
关键词
nanostructured materials; sintering; microstructure; electrical resistivity; thermal conductivity;
D O I
10.1016/S0167-577X(01)00330-5
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The effect of temperature on the electrical resistivity and thermal conductivity of W-Cu composites had been studied. In case of pure W and Cu, the thermal conductivity decreased with increase in temperature. However, the W-Cu composites showed increased thermal conductivity with increase of temperature up to 500 degreesC, and then the conductivity decreased with increasing temperatures. This increase in thermal conductivity is explained by the increased number and movement of electrons as well as increased conduction paths for the electrons. The scattering of phonons is believed to be responsible for the decrease of thermal conductivity at the temperature of above 500 degreesC. (C) 2001 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:420 / 424
页数:5
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