共 9 条
[1]
Obeying Moore's Law beyond 0.18 micron
[J].
13TH ANNUAL IEEE INTERNATIONAL ASIC/SOC CONFERENCE, PROCEEDINGS,
2000,
:26-31
[2]
Fischer T., 2005, ISSCC, P294
[3]
JI G, 2003, IEEE T ADV PACKAGING, V28, P445
[5]
Lossy power distribution networks with thin dielectric layers and/or thin conductive layers
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
2000, 23 (03)
:353-360
[6]
Design & validation of the Pentium® III and Pentium® 4 processors power delivery
[J].
2002 SYMPOSIUM ON VLSI CIRCUITS, DIGEST OF TECHNICAL PAPERS,
2002,
:220-223
[7]
Power distribution system design methodology and capacitor selection for modern CMOS technology
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
1999, 22 (03)
:284-291
[8]
SWAMINATHAN M, 2001, P INSTR MEAS TECHN C, V2, P1339
[9]
Waizman A, 2000, ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, P65