Introduction to the Special Issue on the 2007 International Integrated Reliability Workshop

被引：0

作者：

Lenahan, Patrick M. ^{[1
]}

Knowlton, Bill ^{[2
]}

Conley, John F., Jr. ^{[3
]}

Tonti, Bill ^{[4
]}

Suehle, John ^{[5
]}

Grasser, Tibor ^{[6
]}

机构：

[1] Penn State Univ, University Pk, PA 16801 USA

[2] Boise State Univ, Boise, ID 83725 USA

[3] Oregon State Univ, Corvallis, OR 97331 USA

[4] IBM Microelect, Essex Jct, VT 05452 USA

[5] NIST, Gaithersburg, MD 20899 USA

[6] Vienna Univ Technol, A-1040 Vienna, Austria

来源：

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | 2008年 / 8卷 / 03期

关键词：

D O I：

10.1109/TDMR.2008.2006011

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

No abstract available

引用

页码：490 / 490

页数：1

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