Global simulation of the Czochralski silicon crystal growth in ANSYS FLUENT

被引:35
作者
Kirpo, Maksims [1 ]
机构
[1] Bosch Solar Energy AG, D-99310 Arnstadt, Germany
关键词
Computer simulation; Turbulent convection; Czochralski method; Semiconducting Silicon; OXYGEN-TRANSPORT; CONVECTION; DESIGN; FIELD; FLOW; MM;
D O I
10.1016/j.jcrysgro.2013.02.005
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
Silicon crystals for high efficiency solar cells are produced mainly by the Czochralski (CZ) crystal growth method. Computer simulations of the CZ process established themselves as a basic tool for optimization of the growth process which allows to reduce production costs keeping high quality of the crystalline material. The author shows the application of the general Computational Fluid Dynamics (CFD) code ANSYS FLUENT to solution of the static two-dimensional (2D) axisymmetric global model of the small industrial furnace for growing of silicon crystals with a diameter of 100 mm. The presented numerical model is self-sufficient and incorporates the most important physical phenomena of the CZ growth process including latent heat generation during crystallization, crystal-melt interface deflection, turbulent heat and mass transport, oxygen transport, etc. The demonstrated approach allows to find the heater power for the specified pulling rate of the crystal but the obtained power values are smaller than those found in the literature for the studied furnace. However, the described approach is successfully verified with the respect to the heater power by its application for the numerical simulations of the real CZ pullers by "Bosch Solar Energy AG". (C) 2013 Elsevier B.V. All rights reserved.
引用
收藏
页码:60 / 69
页数:10
相关论文
共 50 条
[41]   Particularities of the thermal and oxygen concentration instabilities in a Czochralski process for solar silicon growth [J].
Popescu, Alexandra ;
Vizman, Daniel .
JOURNAL OF CRYSTAL GROWTH, 2023, 611
[42]   Transient global modeling for the pulling process of Czochralski silicon crystal growth. I. Principles, formulation, and implementation of the model [J].
Liu, Xin ;
Harada, Hirofumi ;
Miyamura, Yoshiji ;
Han, Xue-feng ;
Nakano, Satoshi ;
Nishizawa, Shin-ichi ;
Kakimoto, Koichi .
JOURNAL OF CRYSTAL GROWTH, 2020, 532
[43]   Simulation of large-scale silicon melt flow in magnetic Czochralski growth [J].
Savolainen, V ;
Heikonen, J ;
Ruokolainen, J ;
Anttila, O ;
Laakso, M ;
Paloheimo, J .
JOURNAL OF CRYSTAL GROWTH, 2002, 243 (02) :243-260
[44]   Global analysis of a small Czochralski furnace with rotating crystal and crucible [J].
Li, YR ;
Akiyama, Y ;
Imaishi, N ;
Tsukada, T .
JOURNAL OF CRYSTAL GROWTH, 2003, 255 (1-2) :81-92
[45]   Role of characteristic modes in the dynamics of wave pattern in the Czochralski oxide crystal growth [J].
Jing, C. J. ;
Jia, C. X. ;
Li, K. ;
Arima, H. .
JOURNAL OF CRYSTAL GROWTH, 2012, 340 (01) :190-196
[46]   Vacancy behavior in Czochralski silicon growth [J].
Lee, Sang Hun ;
Kang, Jeong Won ;
Hong, Young Ho ;
Oh, Hyun Jung ;
Kim, Do Hyun .
JOURNAL OF CRYSTAL GROWTH, 2009, 311 (14) :3592-3597
[47]   Analysis of the effect of symmetric/asymmetric CUSP magnetic fields on melt/crystal interface during Czochralski silicon growth [J].
Daggolu, Parthiv ;
Ryu, Jae Woo ;
Galyukov, Alex ;
Kondratyev, Alexey .
JOURNAL OF CRYSTAL GROWTH, 2016, 452 :22-26
[48]   Numerical and experimental investigation of oxygen transport in 300 mm Czochralski silicon crystal growth with transverse magnetic fields [J].
Liu, Wenkai ;
Chen, Songsong ;
Jiang, Fuman ;
Liu, Yun ;
Xue, Zhongying ;
Wei, Xing .
VACUUM, 2025, 233
[49]   Reduction of oxygen during the crystal growth in heavily antimony-doped Czochralski silicon [J].
Yang, DR ;
Li, CL ;
Luo, MC ;
Xu, J ;
Que, DL .
JOURNAL OF CRYSTAL GROWTH, 2003, 256 (3-4) :261-265
[50]   Effect of heater structure on oxygen concentration in large diameter n-type Czochralski silicon study using numerical simulation [J].
Zhao, Liang ;
Li, Tai ;
Huang, Zhenling ;
Zhou, Xiang ;
Kang, Jiaming ;
Ma, Wenhui ;
Li, Shaoyuan ;
Lv, Guoqiang ;
Ren, Yongsheng .
APPLIED THERMAL ENGINEERING, 2024, 257