Precipitation induced by diffusivity anisotropy in Sn grains under electron current stressing

被引：18

作者：

Huang, T. C. ^{[1
]}

Yang, T. L. ^{[1
]}

Ke, J. H. ^{[1
]}

Li, C. C. ^{[1
]}

Kao, C. R. ^{[1
]}

机构：

[1] Natl Taiwan Univ, Dept Mat Sci & Engn, Taipei 10764, Taiwan

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2013年 / 555卷

关键词：

Electromigration; Precipitation; Crystallography orientation; Intermetallic compound; CHIP SOLDER JOINTS; FAILURE MECHANISMS; ELECTROMIGRATION; ORIENTATION;

D O I：

10.1016/j.jallcom.2012.12.060

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Nickel diffuses five orders of magnitude faster along the c-axis of white Sn than along the a-axis. Experimental evidence is presented to show that, when Ni atoms diffuse from a Sn grain with its c-axis aligned with the Ni flux direction, across the grain boundary, and then into a neighboring Sn grain with its a-axis aligned with the Ni flux direction, Ni3Sn4 will preferentially precipitates at the Sn grain boundary. This is a direct proof that precipitation can be caused by the diffusivity anisotropy of a diffusion medium. (C) 2012 Elsevier B.V. All rights reserved.

引用

页码：237 / 240

页数：4

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