Printed wiring board technology featured at '99 JPCA show

被引：0
|
作者：
Yasufuku, S
机构：
来源：
IEEE ELECTRICAL INSULATION MAGAZINE | 1999年 / 15卷 / 05期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：54 / 55
页数：2
相关论文
共 50 条
  • [31] OVERVIEW OF ROBOTICS FOR PRINTED WIRING BOARD ASSEMBLY.
    Dudley, John
    Electri-onics, 1987, 33 (01): : 40 - 41
  • [32] DIRECT MOUNTING OF CHIP CARRIERS ON PRINTED WIRING BOARD
    ITOH, M
    SAKAI, Y
    MIWA, M
    TAKETOMI, K
    NEC RESEARCH & DEVELOPMENT, 1982, (65): : 33 - 38
  • [33] DEVELOPMENT OF FLEX-RIGID PRINTED WIRING BOARD
    YAMAGUCHI, C
    SAITOH, H
    OKITA, K
    BABA, K
    IWATA, H
    SHARP TECHNICAL JOURNAL, 1989, (41): : 105 - 107
  • [34] Drop induced impact response of a printed wiring board
    He, XL
    Stallybrass, M
    INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2002, 39 (24) : 5979 - 5990
  • [35] REPAIR FACILITY FOR PRINTED WIRING BOARD CONTACT FINGERS
    LANDAU, U
    MATHIAS, WT
    HAUGHT, DE
    PURYEAR, LB
    WESTERN ELECTRIC ENGINEER, 1978, 22 (02): : 82 - &
  • [36] Embedded Capacitors in Printed Wiring Board: A Technological Review
    Mohammed A. Alam
    Michael H. Azarian
    Michael G. Pecht
    Journal of Electronic Materials, 2012, 41 : 2286 - 2303
  • [37] Manufacturing cost modeling in printed wiring board assembly
    Teng, SHG
    Garimella, SS
    JOURNAL OF MANUFACTURING SYSTEMS, 1998, 17 (02) : 87 - 96
  • [38] New epoxy resins for printed wiring board applications
    Hoevel, Bernd
    Valette, Ludovic
    Gan, Joseph
    CIRCUIT WORLD, 2007, 33 (02) : 17 - 27
  • [39] Development of new printed wiring board with coaxial wirings
    Sato, Y
    Tanaka, N
    Kikuchi, K
    Nakagawa, H
    Tokoro, K
    Kawashima, A
    Kawamata, Y
    Kobayashi, K
    Aoyagi, M
    2002 INTERNATIONAL CONFERENCE ON ADVANCED PACKAGING AND SYSTEMS, PROCEEDINGS, 2002, 4828 : 92 - 97
  • [40] Parametric study of warpage in printed wiring board assemblies
    Ding, H
    Ume, IC
    Powell, RE
    Hanna, CR
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2005, 28 (03): : 517 - 524
12345