A copper CMOS-MEMS Z-axis gyroscope

被引:9
作者
Luo, H [1 ]
Zhu, X [1 ]
Lakdawala, H [1 ]
Carley, LR [1 ]
Fedder, GK [1 ]
机构
[1] Carnegie Mellon Univ, Dept Elect & Comp Engn, Pittsburgh, PA 15213 USA
来源
FIFTEENTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2002年
关键词
D O I
10.1109/MEMSYS.2002.984350
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports the first thin film Z-axis gyroscope fabricated in a copper CMOS-MEMS process [5]. It works in the ambient pressure of 1atm and does not depend on Q enhancement. The sensor is integrated with the conditioning circuits in a commercial low-k digital copper CMOS process. The benefit of the copper CMOS-MEMS process includes high mass density and low stress. The device was fabricated in the UMC 0.18 mum six copper layer CMOS process with a dimension of 410 mum by 330 mum. It consists of an outer rigid vibrating frame and an inner accelerometer to detect the Coriolis force. Measured driving mode resonant frequency is 8.8 kHz, the sensitivity is 0.8 muV/degrees/sec and the noise floor is 0.5 degrees/sec/rootHz.
引用
收藏
页码:631 / 634
页数:4
相关论文
共 7 条
[1]  
BEAK SS, MEMS 99, P612
[2]  
CLARK WA, SOLID STAT SENS ACT, P283
[3]   Laminated high-aspect-ratio microstructures in a conventional CMOS process [J].
Fedder, GK ;
Santhanam, S ;
Reed, ML ;
Eagle, SC ;
Guillou, DF ;
Lu, MSC ;
Carley, LR .
SENSORS AND ACTUATORS A-PHYSICAL, 1996, 57 (02) :103-110
[4]   A new silicon rate gyroscope [J].
Geiger, W ;
Folkmer, B ;
Merz, J ;
Sandmaier, H ;
Lang, W .
MICRO ELECTRO MECHANICAL SYSTEMS - IEEE ELEVENTH ANNUAL INTERNATIONAL WORKSHOP PROCEEDINGS, 1998, :615-620
[5]  
KRANZ MS, 1997, P S GYR TECHN STUTT
[6]  
LUO H, 2000, INT S SMART STRUCT M, P1
[7]  
ZHU X, 2001, 11 INT C SOL STAT SE, P1548