Preparation of Cu-coated Diamond Particles and Its Influence on the Performances of Diamond/Cu Composites

被引：7

作者：

Zhang Yujun ^{[1
]}

Cai Huachun ^{[1
]}

Shen Zhuoshen ^{[1
]}

机构：

[1] Xian Univ Sci & Technol, Xian 710043, Peoples R China

来源：

PROGRESS IN MATERIALS AND PROCESSES, PTS 1-3 | 2013年 / 602-604卷

关键词：

Diamond/Cu composites; electroless plating; thermal conductivity; relative density;

D O I：

10.4028/www.scientific.net/AMR.602-604.66

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Cu-coated diamond particles in variable mass ratio of diamond and Cu are prepared by electroless plating process, then the coated particles are sintered by Spark Plasma Sintering (SPS) respectively. Diamond/Cu composites with high content of diamond(70vol%) are obtained eventually. The results indicate that not only coating diamond by copper electroless plating process could be used to obtain well-dispersed Diamond/Cu composites, but also effectively to improve the relative density of the sintered body, the relative density of the sintered body at 70vol% content of diamond is about 97.5%, as well as to obtain the composite with higher thermal conductivity. Thermal conductivity of the 70vol% Diamond-Cu composite reaches as high as 404 W/(m.K).

引用

页码：66 / 70

页数：5

共 12 条

[1] Heat transport across the metal-diamond interface [J].

Battabyal, M. ;

Beffort, O. ;

Kleiner, S. ;

Vaucher, S. ;

Rohr, L. .

[2] Composite materials for thermal expansivity matching and high heat flux thermal management [J].

Kelly, Anthony .

ADVANCES IN COMPOSITE MATERIALS AND STRUCTURES, PTS 1 AND 2, 2007, 334-335 :1017-1020

[3]

Marsh G., 2003, Mater. Today, V6, P28, DOI DOI 10.1016/S1369-7021(03)00531-5

[4] Processing of diamond particle dispersed aluminum matrix composites in continuous solid-liquid co-existent state by SPS and their thermal properties [J].

Mizuuchi, Kiyoshi ;

Inoue, Kanryu ;

Agari, Yasuyuki ;

Morisada, Yoshiaki ;

Sugioka, Masami ;

Tanaka, Motohiro ;

Takeuchi, Takashi ;

Tani, Jun-ichi ;

Kawahara, Masakazu ;

Makino, Yukio .

COMPOSITES PART B-ENGINEERING, 2011, 42 (04) :825-831

[5]

Oliveira L. J. D., 2012, INT J REFRA IN PRESS

[6] Fabrication and properties of graphite flakes/metal composites for thermal management applications [J].

Prieto, R. ;

Molina, J. M. ;

Narciso, J. ;

Louis, E. .

SCRIPTA MATERIALIA, 2008, 59 (01) :11-14

[7] Improved interfacial adhesion between diamond film and copper substrate using a Cu(Cr)-diamond composite interlayer [J].

Qiu, W. Q. ;

Liu, Z. W. ;

He, L. X. ;

Zeng, D. C. ;

Mai, Y. -W. .

MATERIALS LETTERS, 2012, 81 :155-157

[8] Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications [J].

Schubert, Th. ;

Trindade, B. ;

Weissgaerber, T. ;

Kieback, B. .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2008, 475 (1-2) :39-44

[9] A study on graphitization of diamond in copper-diamond composite materials [J].

Shao, WZ ;

Ivanov, VV ;

Zhen, L ;

Cui, YS ;

Wang, Y .

MATERIALS LETTERS, 2004, 58 (1-2) :146-149

[10] Thermal properties of diamond/copper composite material [J].

Yoshida, K ;

Morigami, H .

MICROELECTRONICS RELIABILITY, 2004, 44 (02) :303-308

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