TSV Modeling and Thermal Analysis Based on 3D Package

被引：0
|
作者：
Tian Wenchao [1 ]
Wang Wenlong [1 ]
Wang Hongming [1 ]
机构：
[1] Xidian Univ, Sch Electromech Engn, Xian 710071, Shaanxi, Peoples R China
来源：
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) | 2012年
关键词：
TSV; 3D lamination; electronic packaging;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
TSV heat models with different pitches, straight through holes and circular truncated cones are established. Simulation results are obtained, and compared with wire bonding results. The conclusion that the heat dissipation effect of TSV technology is better than that of wire bonding technology is obtained. Heat dissipation effect has nothing to do with TSV shape under the same TSV pitches.
引用
收藏
页码：545 / 547
页数：3
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