Numerical Study on Thermal Boundary Resistance and Conductive Properties of Cu/Al Interface

被引:1
|
作者
Ling, Zhi-Yong [1 ]
Qian, Long [1 ]
Cheng, Guang-Gui [1 ]
Zhang, Zhong-Qiang [1 ]
Sun, Dong-Jian [1 ]
机构
[1] Jiangsu Univ, Ctr Micro Nano Sci & Technol, Zhenjiang 212013, Peoples R China
来源
MICRO-NANO TECHNOLOGY XIV, PTS 1-4 | 2013年 / 562-565卷
关键词
Cu/Al interface; thermal boundary resistance; conductive properties; copper component;
D O I
10.4028/www.scientific.net/KEM.562-565.1190
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In this paper, the thermal boundary resistance and conductive properties of Cu/Al interface are investigated by using first-principles calculations based on density functional theory (DFT) with considering the pressure influence. Based on the atomic model of Cu/Al interface the simulation results show that the lattice parameters for both Cu and Al are sensitive to pressure and density states of Cu/Al interface increase as pressure increases from 0 to 5 GPa. Although Cu and Al have the same atomic structure, the significant differences of the density of phonon states lead to the thermal resistance that exists at the Cu/Al interface. At the Cu/Al interface, Cu and Al atoms can diffuse into each other and form an alloy-like interfacial region. The change of the copper component in the alloy can considerably affect the conductive properties of Cu/Al interface.
引用
收藏
页码:1190 / 1195
页数:6
相关论文
共 50 条
  • [1] Numerical investigation on thermal properties at Cu-Al interface in micro/nano manufacturing
    Zhang, Liqiang
    Yang, Ping
    Chen, Min
    Liao, Ningbo
    APPLIED SURFACE SCIENCE, 2012, 258 (08) : 3975 - 3979
  • [2] Numerical Simulation of Cu-Cu Interface Thermal Resistance By Utilizing Laser Photothermal Method
    Zhang, Qingzhi
    Wu, Gang
    Pang, Zhiyang
    Chen, Jinzeng
    Li, Guanghua
    Bi, Ke
    MATERIALS AND COMPUTATIONAL MECHANICS, PTS 1-3, 2012, 117-119 : 195 - 200
  • [3] Numerical investigation of thermal conductivity of Cu/graphene/Cu interface
    Li, Dongbo
    Yang, Haiying
    Li, Lin
    Yang, Ping
    APPLIED PHYSICS LETTERS, 2023, 123 (04)
  • [4] Experimental and numerical study of the effective thermal conductivity of nano composites with thermal boundary resistance
    Kothari, Rushabh
    Sun, Ct.
    Dinwiddie, Ralph
    Wang, Hsin
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2013, 66 : 823 - 829
  • [5] Numerical simulation of thermal properties at Cu/Al interfaces based on hybrid model
    Tang, Yunqing
    Zhang, Liqiang
    Yang, Haiying
    Guo, Juan
    Liao, Ningbo
    Yang, Ping
    ENGINEERING COMPUTATIONS, 2015, 32 (03) : 574 - 584
  • [6] Measurement of thermal contact resistance at Cu-Cu interface
    Kim, Myung Su
    Choi, Yeon Suk
    PROGRESS IN SUPERCONDUCTIVITY AND CRYOGENICS, 2013, 15 (02): : 48 - 51
  • [7] Thermal resistance of thermal conductive adhesive anchored carbon nanotubes interface material
    McNamara, Andrew J.
    Joshi, Yogendra
    Zhang, Zhuomin M.
    INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2015, 96 : 221 - 226
  • [8] The Impact of Interface Defects on Thermal Boundary Resistance at a Si|C Interface
    Stanley, Christopher Martin
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2022, 219 (17):
  • [9] Thermal boundary resistance at the graphene-oil interface
    Konatham, Deepthi
    Striolo, Alberto
    APPLIED PHYSICS LETTERS, 2009, 95 (16)
  • [10] The Role of Interface Vibrational Modes in Thermal Boundary Resistance
    Stanley, Christopher M.
    Rader, Benjamin K.
    Laster, Braxton H. D.
    Servati, Mahsa
    Estreicher, Stefan K.
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2021, 218 (23):