Research of Fan-Out Panel Level Package (FOPLP) manufacturing process using single-sided adhesive tape

被引：0

作者：

Kikuchi, Kazuhiro ^{[1
]}

Karasawa, Yasunori ^{[1
]}

Nedzu, Yuusuke ^{[1
]}

Takano, Ken ^{[1
]}

Yoshinobu, Takeo ^{[1
]}

Sugino, Takashi ^{[1
]}

机构：

[1] Lintec Corp, New Mat Res Dept, Res Ctr, Device Mat Lab,Minami Ku, 7-7-3 Tsuji, Saitama, Saitama 3360026, Japan

来源：

2017 IEEE CPMT SYMPOSIUM JAPAN (ICSJ) | 2017年

关键词：

Panel Level Package; Wafer Level Package; Warpage; Thermosetting Molding material; Pressure Sensitive Adhesive;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Fan-Out Panel Level Package (FOPLP) is well-known process to extend for Fan-Out Wafer Level Package (FOWLP) efficiently in terms of area-fill factor, large-area processability and manufacturing cost. However, they typically require us many unique and novel equipment and thus enormous initial cost tremendously. Here we report new FOPLP manufacturing processes involving single-sided adhesive tapes. We investigated that the warpage of molded package panel, called "panel warpage", will be critically affected by an internal residual stress in the panel which depends on several parameters of the adhesive tapes such as tape thickness and thermo-mechanical properties of the molding material.

引用

页码：83 / 86

页数：4

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