Monolithic Ge-on-Si lasers for large-scale electronic-photonic integration

被引:102
作者
Liu, Jifeng [1 ]
Kimerling, Lionel C. [2 ]
Michel, Jurgen [2 ]
机构
[1] Dartmouth Coll, Thayer Sch Engn, Hanover, NH 03755 USA
[2] MIT, Dept Mat Sci & Engn, Microphoton Ctr, Cambridge, MA 02139 USA
关键词
DOPED N-TYPE; BAND-GAP SHRINKAGE; OPTICAL-PROPERTIES; INFRARED-ABSORPTION; EPITAXIAL-FILMS; GERMANIUM; GAIN; EMISSION; ELECTROLUMINESCENCE; RECOMBINATION;
D O I
10.1088/0268-1242/27/9/094006
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A silicon-based monolithic laser source has long been envisioned as a key enabling component for large-scale electronic-photonic integration in future generations of high-performance computation and communication systems. In this paper we present a comprehensive review on the development of monolithic Ge-on-Si lasers for this application. Starting with a historical review of light emission from the direct gap transition of Ge dating back to the 1960s, we focus on the rapid progress in band-engineered Ge-on-Si lasers in the past five years after a nearly 30-year gap in this research field. Ge has become an interesting candidate for active devices in Si photonics in the past decade due to its pseudo-direct gap behavior and compatibility with Si complementary metal oxide semiconductor (CMOS) processing. In 2007, we proposed combing tensile strain with n-type doping to compensate the energy difference between the direct and indirect band gap of Ge, thereby achieving net optical gain for CMOS-compatible diode lasers. Here we systematically present theoretical modeling, material growth methods, spontaneous emission, optical gain, and lasing under optical and electrical pumping from band-engineered Ge-on-Si, culminated by recently demonstrated electrically pumped Ge-on-Si lasers with >1 mW output in the communication wavelength window of 1500-1700 nm. The broad gain spectrum enables on-chip wavelength division multiplexing. A unique feature of band-engineered pseudo-direct gap Ge light emitters is that the emission intensity increases with temperature, exactly opposite to conventional direct gap semiconductor light-emitting devices. This extraordinary thermal anti-quenching behavior greatly facilitates monolithic integration on Si microchips where temperatures can reach up to 80 degrees C during operation. The same band-engineering approach can be extended to other pseudo-direct gap semiconductors, allowing us to achieve efficient light emission at wavelengths previously considered inaccessible.
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页数:13
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