Current progress on pixel level packaging for uncooled IRFPA

被引:5
|
作者
Dumont, G. [1 ]
Rabaud, W. [1 ]
Yon, J-J. [1 ]
Carle, L. [1 ]
Goudon, V. [1 ]
Vialle, C. [1 ]
Becker, Sebastien [1 ]
Hamelin, Antoine [1 ]
Arnaud, A. [1 ]
机构
[1] MINATEC, CEA LETI, F-38054 Grenoble 9, France
来源
INFRARED TECHNOLOGY AND APPLICATIONS XXXVIII, PTS 1 AND 2 | 2012年 / 8353卷
关键词
uncooled IRFPA; micro-bolometer; Pixel Level Packaging; collective packaging; high volume;
D O I
10.1117/12.919918
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Vacuum packaging is definitely a major cost driver for uncooled IRFPA and a technological breakthrough is still expected to comply with the very low cost infrared camera market. To address this key issue, CEA-LETI is developing a Pixel Level Packaging (PLP) technology which basically consists in capping each pixel under vacuum in the direct continuation of the wafer level bolometer process. Previous CEA-LETI works have yet shown the feasibility of PLP based microbolometers that exhibit the required thermal insulation and vacuum achievement. CEA-LETI is still pushing the technology which has been now applied for the first time on a CMOS readout circuit. The paper will report on the recent progress obtained on PLP technology with particular emphasis on the optical efficiency of the PLP arrangement compared to the traditional microbolometer packaging. Results including optical performances, aging studies and compatibility with CMOS readout circuit are extensively presented.
引用
收藏
页数:8
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