Correlating whisker growth and grain structure on Sn-Cu samples by real-time scanning electron microscopy and backscattering diffraction characterization

被引：31

作者：

Pei, Fei ^{[1
]}

Jadhav, Nitin ^{[1
]}

Chason, Eric ^{[1
]}

机构：

[1] Brown Univ, Sch Engn, Providence, RI 02912 USA

来源：

APPLIED PHYSICS LETTERS | 2012年 / 100卷 / 22期

关键词：

TIN WHISKERS; MECHANISM; TEXTURE; FILMS;

D O I：

10.1063/1.4721661

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Whiskers/hillocks grow out of Pb-free Sn coatings used in electronics manufacturing. To determine which grains form whiskers/hillocks, we use scanning electron microscopy and backscattering diffraction to simultaneously monitor the surface morphology and grain structure. To reduce surface roughness, we developed a "peel-off" method to prepare ultra-flat samples that were measured repeatedly while whiskers/hillocks formed. We find grains that form into whiskers/hillocks are present in the as-deposited film (i.e., not re-nucleated) and many have horizontal grain boundaries beneath them. Grain rotation during whisker/hillock formation means that measurements performed after the features grow do not indicate their initial grain orientations. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4721661]

引用

页数：4