Enhanced Thermal Conductivity and Dielectric Properties of h-BN/LDPE Composites

Low-density polyethylene (LDPE), as an excellent dielectric insulating material, is widely used in electrical equipment insulation, whereas its low thermal conductivity limits its further development and application. Hexagonal boron nitride (h-BN) filler was introduced into LDPE to tailor the properties of LDPE to make it more suitable for high-voltage direct current (HVDC) cable insulation application. We employed melt blending to prepare h-BN/LDPE thermally conductive composite insulation materials with different contents. We focused on investigating the micromorphology and structure, thermal properties, and electrical properties of h-BN/LDPE composites, and explained the space charge characteristics. The scanning electron microscope (SEM) results indicate that the h-BN filler has good dispersibility in the LDPE at a low loading (less than 3 phr (3 g of micron h-BN particles filled in 100g of LDPE)), as well as no heterogeneous phase formation. The results of thermal conductivity analysis show that the introduction of h-BN filler can significantly improve the thermal conductivity of composites. The thermal conductivity of the composite samples with 10 phr h-BN particles is as high as 0.51 W/(m center dot K), which is 57% higher than that of pure LDPE. The electrical performance illustrates that h-BN filler doping can significantly inhibit space charge injection and reduce space charge accumulation in LDPE. The interface effect between h-BN and the substrate reduces the carrier mobility, thereby suppressing the injection of charges of the same polarity and increasing the direct-current (DC) breakdown strength. h-BN/LDPE composite doped with 3 phr h-BN particles has excellent space charge suppression effect and high DC breakdown strength, which is 14.3% higher than that of pure LDPE.