Properties of the passive films present on copper and copper-nickel alloys in slightly alkaline solutions

被引：13

作者：

Ceré, S ^{[1
]}

Vázquez, M ^{[1
]}

机构：

[1] Univ Nacl Mar del Plata, Fac Ingn, INTEMA, Div Corros, Mar Del Plata, Buenos Aires, Argentina

来源：

JOURNAL OF MATERIALS SCIENCE LETTERS | 2002年 / 21卷 / 06期

关键词：

D O I：

10.1023/A:1015394909442

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The influence of Ni as an alloying element in the improvement of the corrosion resistance of copper-base alloys, using boric-borate buffer (pH=7.8) as electrolyte, was studied. Electrochemical and spectrophotometrical techniques were combined to account for the presence of cuprous oxide. When the nickel content increased and reached 30%, the composition of the film changed noticeably by the incorporation of Ni(II) compounds.

引用

页码：493 / 495

页数：3

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