Design and packaging of a vertical free-space opto-electronic interconnect system

被引:0
作者
Zheng, XZ [1 ]
Marchand, PJ [1 ]
Huang, DW [1 ]
Kibar, O [1 ]
Ozkan, N [1 ]
Esener, S [1 ]
机构
[1] Univ Calif San Diego, Dept Elect & Comp Engn, La Jolla, CA 92093 USA
来源
OPTICS IN COMPUTING, TECHNICAL DIGEST | 1999年
关键词
D O I
暂无
中图分类号
TP31 [计算机软件];
学科分类号
081202 ; 0835 ;
摘要
引用
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页码:130 / 132
页数:3
相关论文
共 2 条
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    KIAMILEV, FE
    MARCHAND, P
    KRISHNAMOORTHY, AV
    ESENER, SC
    LEE, SH
    [J]. JOURNAL OF LIGHTWAVE TECHNOLOGY, 1991, 9 (12) : 1674 - 1692
  • [2] Ozguz V., 1998, IWIPP Proceedings. IEEE International Workshop on Integrated Power Packaging (Cat. No.98EX203), P66, DOI 10.1109/IWIPP.1998.722309