Point defect evolution in low-temperature MOCVD growth of InN

被引:8
作者
Rauch, Christian [1 ]
Tuna, Oecal [2 ]
Giesen, Christoph [2 ]
Heuken, Michael [2 ,3 ]
Tuomisto, Filip [1 ]
机构
[1] Aalto Univ, Dept Appl Phys, Espoo 00076, Finland
[2] AIXTRON SE, D-52134 Herzogenrath, Germany
[3] Rhein Westfal TH Aachen, GaN Device Technol, D-52074 Aachen, Germany
来源
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE | 2012年 / 209卷 / 01期
关键词
growth; InN; MOCVD; positron annihilation; vacancies; VACANCIES;
D O I
10.1002/pssa.201100083
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We present a systematic study of the influence of the growth temperature on the point defect landscape in metal-organic chemical vapor deposition (MOCVD) InN. State-of-the-art InN layers were grown at temperatures from 500 to 550 degrees C and positron annihilation spectroscopy has been used to investigate the incorporation of vacancy defects during the growth process. We find that a decrease of the growth temperature below 550 degrees C leads to increasing free carrier concentrations and lower mobilities. At the same time, positron measurements observe an enhanced introduction of mixed In-N vacancy complexes which gather preferentially at the interface between the InN layer and the GaN template. As the measured In vacancy concentration seems too low to promote efficient defect complexing, it suggests an increased formation of N vacancies at low temperature growth through insufficient cracking of NH3, which may be responsible for the observed increase in the free carrier concentration. (C) 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
引用
收藏
页码:87 / 90
页数:4
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