A Finite-Deformation Mechanics Theory for Kinetically Controlled Transfer Printing

被引：32

作者：

Feng, Xue ^{[1
,2
]}

Cheng, Huanyu ^{[3
]}

Bowen, Audrey M. ^{[4
]}

Carlson, Andrew W. ^{[5
]}

Nuzzo, Ralph G. ^{[4
]}

Rogers, John A. ^{[4
,5
]}

机构：

[1] Tsinghua Univ, Ctr Mech & Mat, Beijing 100084, Peoples R China

[2] Tsinghua Univ, Dept Engn Mech, AML, Beijing 100084, Peoples R China

[3] Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA

[4] Univ Illinois, Dept Chem, Urbana, IL 61801 USA

[5] Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA

来源：

JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME | 2013年 / 80卷 / 06期

关键词：

THIN-FILM TRANSISTORS; ELASTOPLASTIC ANALYSIS; SOFT LITHOGRAPHY; STAMP COLLAPSE; SILICON; ADHESION; ELECTRONICS;

D O I：

10.1115/1.4023963

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

The widely used steady-state energy release rate G = F/w is extended to account for the elastic energy of deformed compliant stamps, e. g., low-modulus poly(dimethyl siloxane) (PDMS). An analytical expression for the energy release rate is obtained to quantify interfacial adhesion strength in tape peeling tests, and to analyze the dynamics of kinetically controlled transfer printing. The critical delamination velocity to separate retrieval and printing is related to the critical energy release rate and the tensile stiffness of the stamp. Experimental results validate the analytical expression established by the mechanics model.

引用

页数：5

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