Predicting thickness dependent twin boundary formation in sputtered Cu films

被引：21

作者：

Park, NJ

Field, DP

机构：

[1] Washington State Univ, Sch Mech & Mat Engn, Pullman, WA 99164 USA

[2] Kumoh Natl Inst Technol, Dept Mat Sci Engn, Gumi, South Korea

来源：

SCRIPTA MATERIALIA | 2006年 / 54卷 / 06期

关键词：

copper films; texture; twin boundaries; electron backscatter diffraction (EBSD);

D O I：

10.1016/j.scriptamat.2005.11.041

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Triple junctions involving twin boundaries in Cu interconnects of integrated circuits have been shown to be potentially detrimental to the manufacturability of the circuit. Microstructures of annealed Cu films are dependent on film thickness and deposition parameters. This work describes texture and twin boundary development in sputtered and annealed Cu films. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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收藏

页码：999 / 1003

页数：5

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