Mapping Systolic Arrays onto 3D Circuit Structures: Accelerating Convolutional Neural Network Inference

被引:0
|
作者
Kung, H. T. [1 ]
McDanel, Bradley [1 ]
Zhang, Sai Qian [1 ]
机构
[1] Harvard Univ, Cambridge, MA 02138 USA
来源
PROCEEDINGS OF THE 2018 IEEE INTERNATIONAL WORKSHOP ON SIGNAL PROCESSING SYSTEMS (SIPS) | 2018年
关键词
systolic array; convolutional neural network (CNN); deep learning; inference latency; accelerator; 3D-IC implementation; wiring length; power consumption; FPGA;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In recent years, numerous designs have used systolic arrays to accelerate convolutional neural network (CNN) inference. In this work, we demonstrate that we can further speed up CNN inference and lower its power consumption by mapping systolic arrays onto 3D circuit structures as opposed to conventional 2D structures. Specifically, by operating in 3D space, a wide systolic array consisting of a number of subarrays can efficiently implement wide convolutional layers prevalent in state of the art CNNs. Additionally, by accumulating intermediate results along the third dimension, systolic arrays can process partitioned data channels in parallel with reduced data skew for lowered inference latency. We present a building block design using through-silicon vias (TSVs) for the 3D realization of systolic subarrays. We validate the 3D scheme using a 2.5D FPGA design and demonstrate that when mapped onto 3D structures wide systolic arrays can scale up in size without increasing wiring length in interconnecting subarrays. Further, by taking full advantage of 3D structures, we are able to pipeline inference across multiple layers of a CNN over a series of systolic arrays, dramatically reducing the inference time per input sample. These improvements lead to significantly reduced inference latency, which is especially important for real-time applications where it is common to process samples one at a time.
引用
收藏
页码:330 / 336
页数:7
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