Calculating aerial images from EUV masks

被引:27
作者
Pistor, T [1 ]
Neureuther, AR [1 ]
机构
[1] Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
来源
EMERGING LITHOGRAPHIC TECHNOLOGIES III, PTS 1 AND 2 | 1999年 / 3676卷
关键词
EUV mask; aerial image; EUV lithography; TEMPEST; SPLAT; Pistor; partial coherence; multilayer mirror;
D O I
10.1117/12.351153
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Aerial images for line/space patterns, arrays of posts and an arbitrary layout pattern are calculated for EUV masks in a 4X EUV imaging system. Both mask parameters (absorber thickness, side wall angle, corner rounding radius, feature size) and illumination parameters (numerical aperture, degree of partial coherence, angle of incidence) are varied to investigate their effects on the aerial image. To facilitate this study, a parallel version of TEMPEST with a Fourier transform boundary condition was developed and run on a network of 24 microprocessors. Line width variations are observed when absorber thickness or sidewall angle changes. As the line/space pattern scales to smaller dimensions, the aspect ratios of the absorber features increase, introducing geometric shadowing and reducing aerial image intensity and contrast. 100nm square posts have circular images of diameter close to 100nm, but decreasing in diameter significantly when the corner round radius at the mask becomes greater than 50mm. Exterior mask posts image slightly smaller and with higher ellipticity than interior mask posts. The aerial image of the arbitrary test pattern gives insight into the effects of the off-axis incidence employed in EUV lithography systems.
引用
收藏
页码:679 / 696
页数:4
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