Microstructure, dynamic restoration and recrystallization texture of Sn-Cu after rolling at room temperature

A hypoeutectic Sn-0.5wt%Cu alloy was prepared by casting and subsequent rolling under a moderate strain rate (3.5 x 10(-2)s(-1)) at room temperature. The microstructural evolution including boundary formation, dynamic restoration, twinning, and recrystallization texture was examined using the electron back-scattered diffraction (EBSD) technique, aiming to understand the deformation mechanisms of the Sn-Cu system serving under external stress. The results confirmed that a bimodal grain structure was well established, which could be ascribed to the dislocation activities and dynamic restorations including dynamic recovery (DRV) and dynamic re crystallization (DRX). The Cu6Sn5 particle-stimulated nucleation (PSN) was found as the major mechanism of DRX, which was also the dominant factor leading to the formation of < 001 >//RD oriented nuclei. Moreover, DRX nuclei formed along the existing boundaries, resulting in the formation of necklace structure via continuous dynamic recrystallization (CDRX). Twinning involving {301} and {101} twin configurations was identified as the additional mechanism of effective deformation.