Polyfunctional Lewis acids in supramolecular assemblies.

被引:0
|
作者
Gabbaï, FP
Haneline, MR
King, JB
Tsunoda, M
机构
[1] Texas A&M Univ, Dept Chem, College Stn, TX 77843 USA
[2] Univ Fed Sao Carlos, Dept Quim, BR-13560 Sao Carlos, SP, Brazil
关键词
D O I
暂无
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
218-INOR
引用
收藏
页码:A38 / A39
页数:2
相关论文
共 50 条
  • [31] TURNING OUT PISTON ASSEMBLIES.
    Freeman, Nancy Brooke
    American machinist, 1982, 126 (02): : 118 - 119
  • [32] METAL FATIGUE OF WELDED ASSEMBLIES.
    Wright, D.H.
    Automotive Engineer (London), 1987, 12 (04): : 36 - 38
  • [33] NEW DESIGNS FOR HYDROTURBINE ASSEMBLIES.
    Volkov, A.F.
    Soviet Energy Technology (English translation of Energomashinostroenie), 1986, (05): : 25 - 27
  • [34] CONFORMAL COATINGS FOR PC ASSEMBLIES.
    Waryold, John
    Insulation, circuits, 1982, 28 (01): : 40 - 45
  • [35] SPM study of monolayer assemblies.
    Fujihira, M
    Okabe, Y
    Tani, Y
    Azehara, H
    Yagi, K
    Furugoori, M
    Akiba, U
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1998, 216 : U101 - U101
  • [36] Selectivity of cyclodextrins as a parameter to tune the formation of pseudorotaxanes and micelles supramolecular assemblies. A systematic SANS study
    Lazzara, G.
    Prevost, S.
    Gradzielski, M.
    SOFT MATTER, 2011, 7 (13) : 6082 - 6091
  • [37] Supramolecular semiconductor receptor assemblies. Improved electron transfer at TiO-β-cyclodextrin colloid interfaces
    Willner, I.
    Eichen, Y.
    Willner, B.
    Research on Chemical Intermediates, 1994, 20 (07)
  • [38] CAD/CAM for Microwave Assemblies.
    Goldhorn, Bruno
    Gruetzmann, Sigmar
    1600, (94):
  • [39] Photochemistry of supramolecular systems and nanostructured assemblies. In memory of Professor Nick Turro (1938-2012)
    Credi, Alberto
    CHEMICAL SOCIETY REVIEWS, 2014, 43 (12) : 4003 - 4004
  • [40] Polymerized planar biomembrane assemblies.
    Saavedra, SS
    Ross, EE
    Bondurant, B
    Liu, SC
    Conboy, JC
    O'Brien, DF
    Spratt, T
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2001, 222 : U371 - U372