Analytical Solutions of Heat Transfer and Film Thickness in Thin-Film Evaporation

被引：33

作者：

Yan, Chunji ^{[1
]}

Ma, H. B. ^{[2
]}

机构：

[1] Dalian Maritime Univ, Marine Engn Coll, Dalian 116024, Liaoning Provin, Peoples R China

[2] Univ Missouri, Dept Mech & Aerosp Engn, Columbia, MO 65211 USA

来源：

JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME | 2013年 / 135卷 / 03期

基金：

中国国家自然科学基金;

关键词：

analytical solution; thin film; heat transfer; evaporation; disjoining pressure; TRANSFER COEFFICIENT; MENISCUS; REGION;

D O I：

10.1115/1.4007856

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

A mathematical model predicting heat transfer and film thickness in thin-film region is developed herein. Utilizing dimensionless analysis, analytical solutions have been obtained for heat flux distribution, total heat transfer rate per unit length, location of the maximum heat flux and ratio of conduction thermal resistance to convection thermal resistance in the evaporating film region. These analytical solutions show that the maximum dimensionless heat flux is constant which is independent of the superheat. Maximum total heat transfer rate is determined for a given film region. The ratio of conduction thermal resistance to convection thermal resistance is a function of dimensionless film thickness. This work will lead to a better understanding of heat transfer and fluid flow occurring in the evaporating film region.

引用

页数：6

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