A model for copper deposition in the damascene process

被引：71

作者：

Gabrielli, C ^{[1
]}

Moçotéguy, P

Perrot, H

Nieto-Sanz, D

Zdunek, A

机构：

[1] Univ Paris 06, CNRS, UPR 15, LISE, F-75252 Paris, France

[2] Ctr Rech Claude Delorme, F-78354 Jouy En Josas, France

[3] Chicago Res Ctr, Countryside, IL 60525 USA

来源：

ELECTROCHIMICA ACTA | 2006年 / 51卷 / 8-9期

关键词：

copper; PEG; MPSA; damascene process; copper deposition; organic additives;

D O I：

10.1016/j.electacta.2005.02.127

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Copper deposition in a plating bath known to fill narrow trenches was studied on a rotating disc electrode by impedance measurements. The chemistry of this bath contained, in addition to sulphuric acid, copper sulphate and chloride ions, polyethylene glycol (PEG) as an inhibitor and 3-mercapto-1-propanesulfonate, sodium salt (MPSA) as an accelerator. The experimental results were compared with a model taking into account these organic additives. A competitive adsorption of two complexes: PEG-Cl-Cu-l and (CuSPS)-S-l formed from Cu+ and the additives, is proposed. A good agreement was shown between this model and the experiments on fresh plating bathes. (c) 2005 Published by Elsevier Ltd.

引用

页码：1462 / 1472

页数：11

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