Ortho-Mode Sub-THz Interconnect Channel for Planar Chip-to-Chip Communications

被引：45
|
作者：
Yu, Bo [1 ]
Ye, Yu [1 ]
Ding, Xuan [1 ]
Liu, Yuhao [3 ]
Xu, Zhiwei [2 ]
Liu, Xiaoguang [1 ]
Gu, Qun Jane [1 ]
机构：
[1] Univ Calif Davis, Dept Elect & Comp Engn, Davis, CA 95616 USA
[2] Zhejiang Univ, Hangzhou 310058, Zhejiang, Peoples R China
[3] Skyworks Solut, Irvine, CA 92617 USA
来源：
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2018年 / 66卷 / 04期
基金：
美国国家科学基金会;
关键词：
Channel; chip-to-chip; communication; dielectric waveguide (DWG); interconnect; micromachined; microstrip line (MSL); ortho-mode transition (OMT); space division multiplexing (SDM); sub-THz; THz; TIME-DOMAIN SPECTROSCOPY; OOK TRANSCEIVER; SILICON; CMOS; ANTENNAS; MM;
D O I：
10.1109/TMTT.2017.2779496
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents for the first time the design, fabrication, and demonstration of a dielectric waveguide (DWG)based ortho-mode sub-THz interconnect channel for planar chip-to-chip communications. By combining the proposed new transition of microstrip line with DWG orthogonally, the orthomode transition is constructed to form an ortho-mode channel. The measured minimum insertion losses for the E-y11 mode and the E-x11 mode are 6.6 dB with 20.3-GHz 3-dB bandwidth and 6.5 dB with 55.2-GHz 3-dB bandwidth, respectively. The simulation and measurement results agree well with each other.
引用
收藏
页码：1864 / 1873
页数：10
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