Ortho-Mode Sub-THz Interconnect Channel for Planar Chip-to-Chip Communications

被引：45

作者：

Yu, Bo ^{[1
]}

Ye, Yu ^{[1
]}

Ding, Xuan ^{[1
]}

Liu, Yuhao ^{[3
]}

Xu, Zhiwei ^{[2
]}

Liu, Xiaoguang ^{[1
]}

Gu, Qun Jane ^{[1
]}

机构：

[1] Univ Calif Davis, Dept Elect & Comp Engn, Davis, CA 95616 USA

[2] Zhejiang Univ, Hangzhou 310058, Zhejiang, Peoples R China

[3] Skyworks Solut, Irvine, CA 92617 USA

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2018年 / 66卷 / 04期

基金：

美国国家科学基金会;

关键词：

Channel; chip-to-chip; communication; dielectric waveguide (DWG); interconnect; micromachined; microstrip line (MSL); ortho-mode transition (OMT); space division multiplexing (SDM); sub-THz; THz; TIME-DOMAIN SPECTROSCOPY; OOK TRANSCEIVER; SILICON; CMOS; ANTENNAS; MM;

D O I：

10.1109/TMTT.2017.2779496

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents for the first time the design, fabrication, and demonstration of a dielectric waveguide (DWG)based ortho-mode sub-THz interconnect channel for planar chip-to-chip communications. By combining the proposed new transition of microstrip line with DWG orthogonally, the orthomode transition is constructed to form an ortho-mode channel. The measured minimum insertion losses for the E-y11 mode and the E-x11 mode are 6.6 dB with 20.3-GHz 3-dB bandwidth and 6.5 dB with 55.2-GHz 3-dB bandwidth, respectively. The simulation and measurement results agree well with each other.

引用

页码：1864 / 1873

页数：10

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