A Back-Channel-Etched Amorphous InGaZnO Thin-Film Transistor Technology With Al-Doped ZnO as Source/Drain and Pixel Electrodes

被引:14
作者
Deng, Wei [1 ]
Xiao, Xiang [2 ]
Shao, Yang [2 ]
Song, Zhen [2 ]
Lee, Chia-Yu [3 ]
Lien, Alan [3 ]
Zhang, Shengdong [1 ,2 ]
机构
[1] Peking Univ, Inst Microelect, Beijing 100871, Peoples R China
[2] Peking Univ, Sch Elect & Comp Engn, Shenzhen 518055, Peoples R China
[3] Shenzhen China Star Optoelect Technol Co Ltd, Shenzhen 518107, Peoples R China
基金
中国国家自然科学基金;
关键词
Aluminum-doped ZnO (AZO); amorphous indium-gallium-zinc oxide (a-IGZO); back-channel-etch (BCE); pixel electrode (PE); thin-film transistor (TFT); wet etch; THRESHOLD VOLTAGE; PERFORMANCE; DAMAGE; TFTS; SIO2;
D O I
10.1109/TED.2016.2542862
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A back-channel-etched fabrication process for amorphous indium-gallium-zinc oxide (a-IGZO) thin-film transistors is proposed, in which an alumium-doped ZnO (AZO) transparent conductive film is used to form both source/drain and pixel electrodes. It is demonstrated that rinsed acetic acid solution has a high etching selectivity over 100:1 between AZO and a-IGZO. In addition, bus and interconnect lines are formed in a separate fabrication step in this process, so that the Cu process could be adopted without bringing contamination issue.
引用
收藏
页码:2205 / 2209
页数:5
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