Plasma enhanced chemical vapor deposition of diamond coatings on Cu-W and Cu-WC composites

被引：21

作者：

Wan, B. Q. ^{[1
]}

Sun, X. Y. ^{[1
]}

Ma, H. T. ^{[2
]}

Feng, R. F. ^{[3
]}

Li, Y. S. ^{[1
]}

Yang, Q. ^{[1
]}

机构：

[1] Univ Saskatchewan, Dept Mech Engn, Saskatoon, SK S7N 5A9, Canada

[2] Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116085, Peoples R China

[3] Univ Saskatchewan, Canadian Light Source, Saskatoon, SK S7N 0X4, Canada

来源：

SURFACE & COATINGS TECHNOLOGY | 2015年 / 284卷

基金：

加拿大创新基金会; 加拿大自然科学与工程研究理事会;

关键词：

Diamond coating; Chemical vapor deposition; Cu-W composite; Adhesion; RAMAN-SPECTROSCOPY; COPPER; NUCLEATION; FILMS; TUNGSTEN; INTERLAYERS; ADHESION; GROWTH; CVD; ALLOY;

D O I：

10.1016/j.surfcoat.2015.06.079

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

In this study, two Cu-W (Cu30-W, Cu40-W) and one Cu50-WC composites (all in wt.%) were synthesized by powder metallurgy and used as substrates for diamond coating in a microwave plasma enhanced chemical vapor deposition reactor. Optical microscopy, scanning electron microscopy, Raman spectroscopy, X-ray diffraction, indentation test and synchrotron-based high resolution X-ray near edge absorption spectroscopy were used to investigate the morphology, composition, microstructures and adhesion of diamond films. The results show that the adhesion of diamond coatings formed on these Cu-W alloy substrates is much higher than on pure Cu substrate. The adhesion improvement is primarily attributed to the reduced mismatch in the thermal expansion coefficients, and the formation of WC phase on the sub-surface of the substrate that strengthens the coating-substrate interfacial bonding. (C) 2015 Elsevier B.V. All rights reserved.

引用

页码：133 / 138

页数：6

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