Fabrication and Characterization of Electrospun Composite Materials

被引:0
作者
Bian, Shanshan [1 ]
Jayaram, Shesha H. [1 ]
Cherney, Edward A. [1 ]
机构
[1] Univ Waterloo, Dept Elect & Comp Engn, Waterloo, ON N2L 3G1, Canada
来源
2012 IEEE 10TH INTERNATIONAL CONFERENCE ON THE PROPERTIES AND APPLICATIONS OF DIELECTRIC MATERIALS (ICPADM) | 2012年
关键词
Electrospinning; composites; fillers; heat resistance; TGA; thermal conductivity;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work, the characteristics of silicone rubber (SiR) and epoxy composites prepared by using the electrospinning technique are compared with conventionally prepared composite materials. Both micron sized silica fillers and silica/aluminum nanofillers are used in preparing the composites. The technique of electrospinning was used to enhance the dispersion of nanofillers by embedding the fillers in the polymer. The thermo-gravimetric analysis(TGA) of the composites has shown that the interfacial bonding between the fillers and the polymer matrix is strong in those samples prepared using the ES technique, which agrees with the uniform filler morphology observed in the SEM images. Further, it has been shown that heat resistance, tensile strength, and elongation at break for electrospun SiR samples are better than those for conventionally prepared samples. Similarly, for epoxy composites prepared using ES technique, a significant improvement In thermal properties have been obtained.
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页数:4
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