Corrosion Behavior of Sn-3.0Ag-0.5Cu Lead-Free Solder in Potassium Hydroxide Electrolyte

被引：29

作者：

Liew, Mui Chee ^{[1
]}

Ahmad, Ibrahym ^{[1
]}

Lee, Liu Mei ^{[1
]}

Nazeri, Muhammad Firdaus Mohd ^{[1
]}

Haliman, Habsah ^{[1
]}

Mohamad, Ahmad Azmin ^{[1
]}

机构：

[1] Univ Sains Malaysia, Sch Mat & Mineral Resources Engn, Nibong Tebal 14300, Penang, Malaysia

来源：

METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE | 2012年 / 43A卷 / 10期

关键词：

ELECTROCHEMICAL CORROSION; BUFFER SOLUTIONS; ANODIC BEHAVIOR; NACL SOLUTION; ALLOYS; TIN; SN;

D O I：

10.1007/s11661-012-1194-5

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) solder alloy in 6 M potassium hydroxide electrolyte was investigated using polarization analysis. The results revealed that SAC305 is susceptible to corrosion because of the dissolution of the Sn phase. The corrosion potential (E (corr)) and corrosion current density (i (corr)) obtained from the sample was -1.108 V vs Hg/HgO and 1.795 x 10(-4) A cm(-2), respectively. In addition, microstructural and elemental characterization revealed the presence of tin oxide, Cu, and/or Ag-containing corrosion product on the surface of the corroded sample. The morphology of the samples was also observed to contain several pits, cracks, and pore-like structures.

引用

页码：3742 / 3747

页数：6

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