Double-sided liquid cooling for power semiconductor devices using embedded power packaging

This paper presents double-sided liquid thermal management schemes for MOSFETs using Embedded Power technology. Physics based RC lumped thermal models were developed for Embedded Power with double-sided forced liquid convection and a wire bond package with single-sided forced liquid convection. Embedded Power with double-sided liquid cooling is expected to produce up to a 40% reduction in thermal resistance compared to a wire bond package with single-sided liquid cooling. A liquid module test bed has been created based on the convection modeled and is used with MOSFET based samples to explore the validity of the modeling results. Temperature measurements from experimental results are comparable to the modeling results for single-side cooled wire bond packaging for a loss between 10 to 100W and 0.15 to 5 GPM water flow rate. Pulse loss results also mimic transient heat transfer trends depicted in modeling. Experiments for double-sided cooling with embedded power are in progress.