Properties, microstructure and texture evolution of cold rolled Cu strips under electropulsing treatment

被引:49
作者
Zhu, R. F. [1 ,2 ]
Liu, J. N. [1 ,2 ]
Tang, G. Y. [1 ,2 ]
Shi, S. Q. [3 ]
Fu, M. W. [3 ]
机构
[1] Tsinghua Univ, Adv Mat Inst, Grad Sch Shenzhen, Shenzhen 518055, Peoples R China
[2] Tsinghua Univ, Key Lab Adv Mat, Minist Educ, Dept Mat Sci & Engn, Beijing 100084, Peoples R China
[3] Hong Kong Polytech Univ, Dept Mech Engn, Kowloon, Hong Kong, Peoples R China
基金
中国国家自然科学基金;
关键词
Electropulsing treatment; Electron back scattered diffraction; Microstructure; Texture; Cu strips; RECRYSTALLIZATION TEXTURES; ALLOY; BOUNDARIES; STRENGTH; COPPER;
D O I
10.1016/j.jallcom.2012.07.150
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The effect of electropulsing treatment (EPT) on properties, microstructures and texture of the cold-rolled Cu strips is investigated by electron back scattered diffraction (EBSD). The results show that the elongation of Cu strips increases while the Vickers hardness and electrical resistivity drop with the increase of the frequency of electropulsing excluding 600 Hz. The grain size increased with increasing the frequency of electropulsing. The frequency of coincident site lattice (CSL) and twin reach the maximum using the EPT of 400 Hz. In addition, the change of microstructure induced by EPT strengthens P{011}< 12 (2) over bar > orientation and weakens S{123}< 63 (4) over bar > and Bs{110}< 1 (1) over bar2 > texture component content. The twin formation and crystallization mechanism of the cold deformed Cu under electropulsing are proposed. (C) 2012 Elsevier B.V. All rights reserved.
引用
收藏
页码:203 / 208
页数:6
相关论文
共 25 条
  • [1] [Anonymous], 2005, Diffusion Processes in Advanced Technological Materials
  • [2] [Anonymous], PHYS MET METALL
  • [3] MECHANICS OF ELECTROSTIMULATED WIRE DRAWING
    BAZAYKIN, VI
    GROMOV, VE
    KUZNETSOV, VA
    PERETYATKO, VN
    [J]. INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 1991, 27 (13) : 1639 - 1643
  • [4] Observation of atomic diffusion at twin-modified grain boundaries in copper
    Chen, Kuan-Chia
    Wu, Wen-Wei
    Liao, Chien-Neng
    Chen, Lih-Juann
    Tu, K. N.
    [J]. SCIENCE, 2008, 321 (5892) : 1066 - 1069
  • [5] EFFECT OF ELECTRIC-CURRENT PULSES ON THE RECRYSTALLIZATION OF COPPER
    CONRAD, H
    KARAM, N
    MANNAN, S
    [J]. SCRIPTA METALLURGICA, 1983, 17 (03): : 411 - 416
  • [6] On the formation of recrystallization textures in binary Al-1.3% Mn investigated by means of local texture analysis
    Engler, O
    Yang, P
    Kong, XW
    [J]. ACTA MATERIALIA, 1996, 44 (08) : 3349 - 3369
  • [7] Recrystallisation textures in copper-manganese alloys
    Engler, O
    [J]. ACTA MATERIALIA, 2001, 49 (07) : 1237 - 1247
  • [8] The role of annealing twins during recrystallization of Cu
    Field, D. P.
    Bradford, L. T.
    Nowell, M. M.
    Lillo, T. M.
    [J]. ACTA MATERIALIA, 2007, 55 (12) : 4233 - 4241
  • [9] The role of shear stress in the formation of annealing twin boundaries in copper
    Field, DP
    Eames, RC
    Lillo, TM
    [J]. SCRIPTA MATERIALIA, 2006, 54 (06) : 983 - 986
  • [10] A quantitative analysis of the evolution of texture and stored energy during annealing of cold rolled copper
    Gerber, P
    Tarasiuk, J
    Chauveau, T
    Bacroix, B
    [J]. ACTA MATERIALIA, 2003, 51 (20) : 6359 - 6371