Thermal Conductivity and Arcing Resistance of Micro or Hybrid BN Filled Polyethylene under Pulse Strength

被引:13
作者
Du, B. X. [1 ]
Cui, Bin [1 ]
Xiao, Meng [2 ]
机构
[1] Tianjin Univ, Sch Elect Engn & Automat, Key Lab Smart Grid, Educ Minist, Tianjin 300072, Peoples R China
[2] Jinan Power Supply Co, Jinan 250012, Shandong, Peoples R China
关键词
Polyethylene; boron nitride (BN); thermal conductivity; arcing resistance; image processing; surface dielectric breakdown; relative permittivity; TRACKING FAILURE; ELECTRICAL-PROPERTIES; DIELECTRIC-BREAKDOWN; SILICONE-RUBBER; COMPOSITES; INSULATION; NANO;
D O I
10.1109/TDEI.2016.7736870
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work, in order to investigate the effects of thermal conductivity on arcing resistance from the view of thermal accumulation under pulse strength, a range of polyethylene (PE) based composites filled with micro or hybrid boron nitride (BN) particles at different loadings (0, 3, 6 and 9 wt%) were prepared. Thermal conductivity and relative permittivity were measured to characterize the basic properties of various samples. Influences of thermal conductivity on thermal accumulation and arcing resistance were discussed through surface dielectric breakdown test. Obtained results show that the thermal conductivity of BN filled PE composite is obviously improved and the relative permittivity could maintain a relatively low value. At the same pulse frequency, with increasing filler concentration from 0 to 40 wt%, thermal conductivity and the time to surface dielectric breakdown all present increase trend, whereas sample surface maximum temperature and damage degree reflect the opposite tendency. It implies that the increased thermal conductivity contributes to reduce thermal accumulation during arcing discharge, which can help to promote the resistance to arcing discharge. Moreover, PE/hybrid-BN composite presents a higher thermal conductivity, a longer time to surface dielectric breakdown and a lower surface damage degree at the same filler content. It is concluded that adding hybrid-BN filler into PE resin can suppress thermal accumulation and improve arcing resistance more effectively.
引用
收藏
页码:3061 / 3070
页数:10
相关论文
共 44 条
  • [1] Du B., 2002, Transactions of the Institute of Electrical Engineers of Japan, Part A, V122-A, P404
  • [2] Effects of Thermally Conducting Particles on Resistance to Tracking Failure of Polyimide/BN Composites
    Du, B. X.
    Xiao, Meng
    [J]. IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2014, 21 (04) : 1565 - 1572
  • [3] Thermal Accumulation and Tracking Failure Process of BN-filler Epoxy-matrix Composite
    Du, B. X.
    Xiao, Meng
    [J]. IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2013, 20 (06) : 2270 - 2276
  • [4] Effect of Thermal Conductivity on Tracking Failure of Epoxy/BN Composite under Pulse Strength
    Du, B. X.
    Xiao, M.
    Zhang, J. W.
    [J]. IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2013, 20 (01) : 296 - 302
  • [5] Du BX, 2005, IEEE T DIELECT EL IN, V12, P1162, DOI 10.1109/TDEI.2005.1561796
  • [6] Environmental factors affecting dc resistance to tracking of polyethylene
    Du, BX
    Kobayashi, S
    [J]. IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2003, 10 (02) : 271 - 277
  • [7] Electrical conductivity and space charge in LDPE containing TiO2 nanoparticles
    Fleming, RJ
    Pawlowski, T
    Ammala, A
    Casey, PS
    Lawrence, KA
    [J]. IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2005, 12 (04) : 745 - 753
  • [8] Thermal conductivity epoxy resin composites filled with boron nitride
    Gu, Junwei
    Zhang, Qiuyu
    Dang, Jing
    Xie, Chao
    [J]. POLYMERS FOR ADVANCED TECHNOLOGIES, 2012, 23 (06) : 1025 - 1028
  • [9] Single wall carbon nanotube/polyethylene nanocomposites: Thermal and electrical conductivity
    Haggenmueller, Reto
    Guthy, Csaba
    Lukes, Jennifer R.
    Fischer, John E.
    Winey, Karen I.
    [J]. MACROMOLECULES, 2007, 40 (07) : 2417 - 2421
  • [10] NUMERICAL-ANALYSIS OF STEADY-STATE THERMAL BREAKDOWN
    HIKITA, M
    IEDA, M
    SAWA, G
    [J]. JOURNAL OF APPLIED PHYSICS, 1983, 54 (04) : 2025 - 2029