Packaging of MEMS Microphones

被引：1

作者：

Feiertag, Gregor ^{[1
]}

Winter, Matthias ^{[1
]}

Leidl, Anton ^{[1
]}

机构：

[1] EPCOS AG, D-81671 Munich, Germany

来源：

SMART SENSORS, ACTUATORS, AND MEMS IV | 2009年 / 7362卷

关键词：

MEMS; Packaging; MEMS Packaging; Microphone; Flip Chip; Chip Size MEMS Package; CSMP; Chip Size SAW Package; CSSP;

D O I：

10.1117/12.821186

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

To miniaturize MEMS microphones we have developed a microphone package using flip chip technology instead of chip and wire bonding. In this new packaging technology MEMS and ASIC are flip chip bonded on a ceramic substrate. The package is sealed by a laminated polymer foil and by a metal layer. The sound port is on the bottom side in the ceramic substrate. In this paper the packaging technology is explained in detail and results of electro-acoustic characterization and reliability testing are presented. We will also explain the way which has led us from the packaging of Surface Acoustic Wave (SAW) components to the packaging of MEMS microphones.

引用

页数：8