0 Effect of cupric sulfate on the microstructure and corrosion behavior of nickel-copper nanostructure coatings synthesized by pulsed electrodeposition technique

被引:71
作者
Do, Quangquan [1 ,2 ]
An, Hongze [1 ]
Wang, Guoxing [1 ]
Meng, Guozhe [1 ]
Wang, Yangqiu [1 ]
Liu, Bin [1 ]
Wang, Junyi [1 ]
Wang, Fuhui [1 ,3 ]
机构
[1] Harbin Engn Univ, Key Lab Superlight Mat & Surface Technol, Corros & Protect Lab, Minist Educ, Harbin 150001, Heilongjiang, Peoples R China
[2] Viet Nam Maritime Univ, Shipbldg Fac, Haiphong, Vietnam
[3] Northeastern Univ, Sch Mat Sci & Engn, Key Lab Anisotropy & Texture Mat MoE, 3-11 Wenhua Rd, Shenyang 110819, Liaoning, Peoples R China
基金
中国国家自然科学基金;
关键词
Corrosion; Polarization; Electrodeposition; Coating; Passive film; NI-BASED SUPERALLOY; GRAIN-SIZE; HIGH-DENSITY; RESISTANCE; STEEL; PH; TEMPERATURE; DEPOSITION; SUBSTRATE; CHARGE;
D O I
10.1016/j.corsci.2018.11.017
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this work, Ni-Cu nano-alloying coatings were synthesized by pulsed electrodeposition technique from electrolyte with 0, 2.5, 5 and 7.5 g/L cupric sulfate. The effect of cupric sulfate on the microstructure, micro-morphology, and corrosion behavior of samples were characterized by transmission electron microscopy (TEM), scanning electron microscopy (SEM), potentiodynamic polarization, and electrochemical impedance spectroscopy (EIS). A Varying amount of Cu was found to co-deposit in the coatings. The adequate amount of Cu can markedly enhanced the corrosion resistance of the coating due to the enhanced resistance to reactions at the metal vertical bar passive film (m vertical bar f) interface and reduction of oxygen vacancies by the dopant of Cu+ in the passive film.
引用
收藏
页码:246 / 259
页数:14
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