Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging

被引：40
作者：
Cui, Hui-Wang [1 ,2 ,3 ,4 ]
Li, Dong-Sheng [1 ,2 ]
Fan, Qiong [1 ,2 ]
Lai, Hua-Xiang [1 ,2 ]
机构：
[1] Shanghai Univ, Coll Automat & Mech Engn, Key State Lab New Displays & Syst Applicat, Shanghai 200072, Peoples R China
[2] Shanghai Univ, Coll Automat & Mech Engn, SMIT Ctr, Shanghai 200072, Peoples R China
[3] Natl Sun Yat Sen Univ, Dept Mat & Optoelect Sci, Kaohsiung 804401, Taiwan
[4] Osaka Univ, Inst Sci & Ind Res, Osaka 5650047, Japan
来源：
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES | 2013年 / 44卷
关键词：
Conductive adhesives; Electronics; Mechanical properties of adhesives; MODE SORPTION MODEL; SOLDER REPLACEMENT; GLASSY-POLYMERS; RELIABILITY; JOINTS; TECHNOLOGIES; ECAS; FUNCTIONALIZATION; WETTABILITY; DISPERSION;
D O I：
10.1016/j.ijadhadh.2013.03.007
中图分类号：
TQ [化学工业];
学科分类号：
0817 ;
摘要：
In this study, we incorporated micro-silver flakes and nano-hexagonal boron nitride (BN) particles into a matrix resin to prepare electrically conductive adhesives (ECAs). The humid and thermal aging results under. a constant relative humidity level of 85% at 85 degrees C revealed that the aged ECAs containing 3 wt% of nano-hexagonal BN particles had high reliability. The contact resistance was low and the shear strength high. Nano-hexagonal BN particles have a good effect on the reliability of ECAs that can be used to improve the properties of ECAs. (c) 2013 Elsevier Ltd. All rights reserved.
引用
收藏
页码：232 / 236
页数：5
相关论文
共 53 条
[1]   Aligned Carbon Nanotube Arrays for Degradation-Resistant, Intimate Contact in Micromechanical Devices [J].
Choi, Jungwook ;
Lee, Jae-Ik ;
Eun, Youngkee ;
Kim, Min-Ook ;
Kim, Jongbaeg .
ADVANCED MATERIALS, 2011, 23 (19) :2231-+
[2]   A study of electrically conductive adhesives as a manufacturing solder alternative [J].
Coughlan, F. M. ;
Lewis, H. J. .
JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (05) :912-921
[3]   High performance electrically conductive adhesives from functional epoxy, micron silver flakes, micron silver spheres and acidified single wall carbon nanotube for electronic package [J].
Cui, Hui-Wang ;
Kowalczyk, Agnieszka ;
Li, Dong-Sheng ;
Fan, Qiong .
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2013, 44 :220-225
[4]   Using a functional epoxy, micron silver flakes, nano silver spheres, and treated single-wall carbon nanotubes to prepare high performance electrically conductive adhesives [J].
Cui, Hui-Wang ;
Li, Dong-Sheng ;
Fan, Qiong .
ELECTRONIC MATERIALS LETTERS, 2013, 9 (03) :299-307
[5]   Novel Fast-Curing Electrically Conductive Adhesives from a Functional Epoxy and Micro Silver Flakes: Preparation, Characterization, and Humid-Thermal Aging [J].
Cui, Hui-Wang ;
Du, Wen-Hui .
JOURNAL OF ADHESION, 2013, 89 (09) :714-726
[6]   Using Nano Hexagonal Boron Nitride Particles and Nano Cubic Silicon Carbide Particles to Improve the Thermal Conductivity of Electrically Conductive Adhesives [J].
Cui, Hui-wang ;
Li, Dong-sheng ;
Fan, Qiong .
ELECTRONIC MATERIALS LETTERS, 2013, 9 (01) :1-5
[7]   Reliability of flexible electrically conductive adhesives [J].
Cui, Hui-wang ;
Li, Dong-sheng ;
Fan, Qiong .
POLYMERS FOR ADVANCED TECHNOLOGIES, 2013, 24 (01) :114-117
[8]   Formulation and Characterization of Electrically Conductive Adhesives for Electronic Packaging [J].
Cui, Hui-wang ;
Fan, Qiong ;
Li, Dong-sheng ;
Tang, Xin .
JOURNAL OF ADHESION, 2013, 89 (01) :19-36
[9]   Preparation and Characterization of a Novel Epoxy Molding Compound with Low Storage Modulus at High Temperature and Low Glass-Transition Temperature [J].
Cui, Hui-Wang ;
Li, Dong-Sheng ;
Fan, Qiong .
JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (09) :2599-2605
[10]   Adhesion of a novel flexible epoxy molding compound and its molecular dynamics simulation [J].
Cui, Hui-wang ;
Li, Dong-sheng ;
Fan, Qiong .
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2012, 35 :50-54
123456