Thermal characterization of diamond-pressure-bond heat sinking for optically pumped mid-infrared lasers

被引：25

作者：

Bewley, WW ^{[1
]}

Felix, CL

Aifer, EH

Stokes, DW

Vurgaftman, I

Olafsen, LJ

Meyer, JR

Yang, MJ

Lee, H

机构：

[1] USN, Res Lab, Washington, DC 20375 USA

[2] Sarnoff Corp, Princeton, NJ 08543 USA

来源：

IEEE JOURNAL OF QUANTUM ELECTRONICS | 1999年 / 35卷 / 11期

关键词：

CW lasers; laser thermal factors; mid-infrared lasers; quantum-well lasers; semiconductor lasers;

D O I：

10.1109/3.798081

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The heat sinking properties of optically pumped semiconductor lasers mounted by the diamond-pressure-bonding (DPB) technique have been evaluated quantitatively. This method combines epi-side-down mounting with minimal processing and top optical access via pumping through the diamond. By correlating the pump-intensity variation of the emission wavelength with its temperature variation, specific thermal resistances have been determined for DPB-mounted type-II "W" lasers operating in the mid-infrared. Values less than or equal to 2.0 K.cm(2)/kW were obtained for all temperatures in the range 140-220 K.

引用

页码：1597 / 1601

页数：5

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