Ozone-exposure and annealing effects on graphene-on-SiO2 transistors

被引:48
作者
Zhang, E. X. [1 ]
Newaz, A. K. M. [2 ]
Wang, B. [2 ]
Zhang, C. X. [1 ]
Fleetwood, D. M. [1 ,2 ]
Bolotin, K. I. [2 ]
Schrimpf, R. D. [1 ]
Pantelides, S. T. [1 ,2 ]
Alles, M. L. [1 ]
机构
[1] Vanderbilt Univ, Dept Elect Engn & Comp Sci, Nashville, TN 37235 USA
[2] Vanderbilt Univ, Dept Phys & Astron, Nashville, TN 37235 USA
关键词
OXIDE; OXIDATION;
D O I
10.1063/1.4753817
中图分类号
O59 [应用物理学];
学科分类号
摘要
We employ resistance measurements and Raman spectroscopy to investigate the effects of UV ozone (UVO) exposure and Ar annealing on graphene-on-SiO2 transistors. Shorter UVO exposures lead to oxygen adsorption and doping; longer exposures lead to significant defect generation and then to etching. Elevated-temperature Ar annealing following UVO exposure leads to local defect healing, as shown by the evolution of the characteristic Raman D-and G-peaks. In striking contrast, the overall graphene transistor resistance increases significantly due to void formation. Density functional calculations show that carbon-oxygen reactions lead to efficient consumption and release of C atoms (as CO or CO2) under conditions of high surface oxygen concentration. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4753817]
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页数:3
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