"Non-equilibrium" grain boundaries in additively manufactured CoCrFeMnNi high-entropy alloy: Enhanced diffusion and strong segregation

被引:11
作者
Choi, Nuri [1 ]
Taheriniya, Shabnam [1 ]
Yang, Sangsun [2 ]
Esin, Vladimir A. [3 ]
Yu, Ji Hun [2 ]
Lee, Jai-Sung [4 ]
Wilde, Gerhard [1 ]
Divinski, Sergiy V. [1 ]
机构
[1] Univ Munster, Inst Mat Phys, D-48149 Munster, Germany
[2] Korea Inst Mat Sci, Powder Mat Div, Chang Won 51508, South Korea
[3] PSL Univ, Ctr Materiaux CNRS, UMR 7633, Mines Paris, F-91003 Evry, France
[4] Hanyang Univ, Dept Mat Sci & Chem Engn, Ansan 15588, South Korea
关键词
OF-THE-ART; MECHANICAL-PROPERTIES; TRACER DIFFUSION; RESIDUAL-STRESS; SELF-DIFFUSION; MICROSTRUCTURE; STRENGTH; SOLIDIFICATION; DISLOCATIONS; STABILITY;
D O I
10.1063/5.0133144
中图分类号
O59 [应用物理学];
学科分类号
摘要
Grain boundary diffusion in an additively manufactured equiatomic CoCrFeMnNi high-entropy alloy is systematically investigated at 500 K under the so-called C-type kinetic conditions when bulk diffusion is completely frozen. In the as-manufactured state, general (random) grain boundaries are found to be characterized by orders-of-magnitude enhanced diffusivities and a non-equilibrium segregation of (dominantly) Mn atoms. These features are explained in terms of a non-equilibrium state of grain boundaries after rapid solidification. The grain boundary diffusion rates are found to be almost independent on the scanning/building strategy used for the specimen's manufacturing, despite pronounced microstructure differences. Grain boundary migration during diffusion annealing turned out to preserve the non-equilibrium state of the interfaces due to continuous consumption of the processing-induced defects by moving boundaries. Whereas the kinetic "non-equilibrium " state of the interfaces relaxes after annealing at 773 K, the non-equilibrium segregation is retained, being further accompanied by a nano-scale phase decomposition at the grain boundaries. The generality of the findings for additively manufactured materials is discussed. Published under an exclusive license by AIP Publishing.
引用
收藏
页数:14
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