Interdigital sensors and transducers

被引：410

作者：

Mamishev, AV ^{[1
]}

Sundara-Rajan, K

Yang, F

Du, YQ

Zahn, M

机构：

[1] Univ Washington, Dept Elect Engn, SEAL, Seattle, WA 98195 USA

[2] Underwriters Labs, Santa Clara, CA 95050 USA

[3] MIT, Dept Elect Engn & Comp Sci, Cambridge, MA 02139 USA

来源：

PROCEEDINGS OF THE IEEE | 2004年 / 92卷 / 05期

关键词：

dielectric measurements; interdigital sensors; nondestructive testing (NDT); sensor design; sensor modeling; spectroscopy; surface acoustic waves (SAWs); transducers;

D O I：

10.1109/JPROC.2004.826603

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This review paper focuses on interdigital electrodes-a geometric structure encountered in a wide variety of sensor and transducer designs. Physical and chemical principles behind the operation of these devices vary so much across different fields of science and technology that the common features present in all devices are often overlooked. This paper attempts to bring under one umbrella capacitive, inductive, dielectric, piezoacoustic, chemical, biological, and microelectromechanical interdigital sensors and transducers. The paper also provides historical perspective, discusses fabrication techniques, modeling of sensor parameters, application examples, and directions of future research.

引用

页码：808 / 845

页数：38

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