Effect of bonding temperature and holding time on properties of hollow structure diffusion bonded joints of TC4 alloy (vol 2, 1960, 2020)

被引：3
作者：
Gao, Wenjing [1 ]
Xing, Shuming [1 ]
Lei, Junxiang [2 ]
机构：
[1] Beijing Jiaotong Univ, Sch Mech Elect & Control Engn, Beijing 100044, Peoples R China
[2] Univ Shanghai Sci & Technol, Sch Mat Sci & Engn, Shanghai 200093, Peoples R China
来源：
SN APPLIED SCIENCES | 2020年 / 2卷 / 12期
关键词：
Diffusion bonding; Hollow structure; Mechanical properties; Microstructure; TC4 titanium alloy;
D O I：
10.1007/s42452-020-03898-2
中图分类号：
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号：
07 ; 0710 ; 09 ;
摘要：
There were some errors in Tables 1, 2 and 3, and in Figure 9b in the initial online publication. The original article has been corrected.
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页数：1
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