Effect of a water film on the material removal behavior of Invar during chemical mechanical polishing

被引：39

作者：

Wang, Wan ^{[1
]}

Hua, Dongpeng ^{[1
]}

Zhou, Qing ^{[1
]}

Li, Shuo ^{[1
]}

Eder, Stefan J. ^{[2
,3
]}

Shi, Junqin ^{[1
]}

Wang, Zhijun ^{[1
]}

Wang, Haifeng ^{[1
]}

Liu, Weimin ^{[1
,4
]}

机构：

[1] Northwestern Polytech Univ, Ctr Adv Lubricat & Seal Mat, State Key Lab Solidificat Proc, Xian 710072, Shaanxi, Peoples R China

[2] AC2T Res GmbH, Viktor Kaplan Str 2-C, A-2700 Wiener Neustadt, Austria

[3] TU Wien, Inst Engn Design & Prod Dev, Lehargasse 6 Objekt 7, A-1060 Vienna, Austria

[4] Chinese Acad Sci, Lanzhou Inst Chem Phys, State Key Lab Solid Lubricat, Lanzhou 730000, Peoples R China

来源：

APPLIED SURFACE SCIENCE | 2023年 / 616卷

关键词：

Chemical mechanical polishing; Water film; Molecular dynamics simulation; Surface roughness; Subsurface damage; MOLECULAR-DYNAMICS; FE-NI; SILICON; CMP; SIMULATION; SURFACE; ALLOYS; SLURRY;

D O I：

10.1016/j.apsusc.2023.156490

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Understanding polishing mechanisms in water-lubricated environments has an important guiding value for surface engineering of precision devices. This work reveals the chemical mechanical polishing (CMP) mechanism of the Invar alloy under water lubrication by use of molecular dynamics simulation. The results show that the appropriate thickness of the water film and polishing speed can significantly reduce the surface roughness of the work piece and eliminate subsurface defects. With the increasing rolling speed, the variation of the surface roughness and subsurface damage thickness exhibits a trend of slowly decreasing and then reaching stability. In addition, with an increase in water film thickness, more defects were formed in the subsurface region due to greater surface stresses, although the roughness could be reduced due to an increase of passivated atoms on the work piece surface. These results would be helpful for understanding the CMP mechanism under waterlubricated conditions and for promoting the development of surface engineering for micro/nano components.

引用

页数：11

共 65 条

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